Characterization of Thin Films Deposited by Physical Vapor Deposition (PVD), Using Electrochemical Impedance Spectroscopy (EIS) Technique
Keywords:Corrosion, DC sputtering, Electrochemical Impedance Spectroscopy (EIS), nanodefects, PVD, Thin films.
In this paper the performance against corrosion of a thin film of NiCu deposited by Physical Vapor Deposition at two different times of deposition, was evaluated. Electrochemical Impedance results in NaCl solution, showed a gradual increase in resistivity due to the degradation of the film (delamination) for both times, along with the deposition of corrosion products on the coating generated by re-combination of substrate oxides.
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