Characterization of Thin Films Deposited by Physical Vapor Deposition (PVD), Using Electrochemical Impedance Spectroscopy (EIS) Technique

Authors

  • Jorge Morales Hernández Centro de Investigación y Desarrollo Tecnológico en Electroquímica S.C.
  • Araceli Mandujano Ruíz Mandujano Ruíz Centro de Investigación y Desarrollo Tecnológico en Electroquímica S.C.
  • Julieta Torrez-González Centro de Investigación y Desarrollo Tecnológico en Electroquímica S.C.
  • René Antaño López Centro de Investigación y Desarrollo Tecnológico en Electroquímica S.C.
  • Federico Castañeda Zaldivar Centro de Investigación y Desarrollo Tecnológico en Electroquímica S.C.
  • Francisco Javier Espinoza Beltrán Centro de Investigación de Estudios Avanzados del I.P.N

DOI:

https://doi.org/10.29356/jmcs.v59i4.88

Keywords:

Corrosion, DC sputtering, Electrochemical Impedance Spectroscopy (EIS), nanodefects, PVD, Thin films.

Abstract

In this paper the performance against corrosion of a thin film of NiCu deposited by Physical Vapor Deposition at two different times of deposition, was evaluated. Electrochemical Impedance results in NaCl solution, showed a gradual increase in resistivity due to the degradation of the film (delamination) for both times, along with the deposition of corrosion products on the coating generated by re-combination of substrate oxides.

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References

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Published

2017-10-12

Issue

Vol. 59 No. 4 (2015): Special Issue: MicroEchem 2015

Section

Regular Articles

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